Multilayer electronic component including non-conductive resin layer on body thereof

ABSTRACT

A multilayer electronic component has a body and a non-conductive resin layer. The non-conductive resin layer includes a body cover portion disposed in a region of an external surface of the body in which an electrode layer of an external electrode is not disposed, and an extending portion extending from the body cover portion between the electrode layer and a conductive resin layer of the external electrode, to thereby suppress arc discharge, improve bending strength, and improve moisture resistance.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application is the continuation application of U.S. patentapplication Ser. No. 16/834,346 filed on Mar. 30, 2020, which claims thebenefit under 35 USC 119(a) of Korean Patent Application No.10-2019-0110682 filed on Sep. 6, 2019 in the Korean IntellectualProperty Office, the entire disclosures of which are incorporated hereinby reference for all purposes.

BACKGROUND 1. Field

The present disclosure relates to a multilayer electronic component.

2. Description of Related Art

A multilayer ceramic capacitor (MLCC) is a type of multilayer electroniccomponent, and may be a chip type capacitor mounted on the printedcircuit boards of various electronic products such as imaging devicesincluding liquid crystal displays (LCDs), plasma display panels (PDPs),and the like, and computers, smartphones, mobile phones, and the like,serving to charge or discharge electricity therein or therefrom.

Such multilayer ceramic capacitors may be used as components of variouselectronic devices due to their relatively small size, relatively highcapacitance, and relative ease of mounting. As various electronicdevices such as computers, mobile devices, or the like are miniaturizedand increased in terms of output, demand for miniaturization and highcapacitance of multilayer ceramic capacitors is increasing.

In addition, as recent interest in vehicle electric/electroniccomponents has increased, multilayer ceramic capacitors have also cometo require relatively high reliability and strength characteristics tobe used in vehicle or infotainment systems.

In order to secure high-reliability and high-strength characteristics, amethod of changing a conventional external electrode, including anelectrode layer, to have a double-layer structure including an electrodelayer and a conductive resin layer has been proposed.

In the double-layer structure including the electrode layer and theconductive resin layer, a resin composition, including a conductivematerial, is applied onto the electrode layer to absorb external impactsand to prevent permeation of plating liquid. As a result, reliabilitymay be improved.

However, as electric vehicles, autonomous vehicles, and the like, havebeen developed in the automotive industry, a greater number ofmultilayer ceramic capacitors are required, and multilayer ceramiccapacitors used in automobiles and the like are required to havestricter moisture resistance reliability and bending strengthcharacteristics secured therein.

SUMMARY

An aspect of the present disclosure is to provide a multilayerelectronic component capable of suppressing arc discharge.

An aspect of the present disclosure is to provide a multilayerelectronic component having improved bending strength characteristics.

An aspect of the present disclosure is to provide a multilayerelectronic component having improved moisture resistancecharacteristics.

An aspect of the present disclosure is to provide a multilayerelectronic component in which electrical connectivity between anelectrode layer and a conductive resin layer is improved, to allow forlow equivalent series resistance (ESR).

However, the objects of the present disclosure are not limited to theabove, and more generally include the concepts described below.

According to an aspect of the present disclosure, a multilayerelectronic component includes a body having dielectric layers, and firstinternal electrodes and second internal electrodes alternately laminatedwith respective dielectric layers interposed therebetween, and havingfirst and second surfaces opposing each other in a lamination direction,third and fourth surfaces connected to the first and second surfaces andopposing each other, and fifth and sixth surfaces connected to the firstto fourth surfaces and opposing each other. A first external electrodeincludes a first electrode layer connected to the first internalelectrodes and a first conductive resin layer disposed on the firstelectrode layer, and having a first connection portion disposed on thethird surface of the body and a first band portion extending from thefirst connection portion to a portion of each of the first, second,fifth, and sixth surfaces, and a second external electrode includes asecond electrode layer connected to the second internal electrodes and asecond conductive resin layer disposed on the second electrode layer,and having a second connection portion disposed on the fourth surface ofthe body and a second band portion extending from the second connectionportion to a portion of each of the first, second, fifth, and sixthsurfaces. A non-conductive resin layer has a body cover portion disposedin a region of external surfaces of the body in which the first andsecond electrode layers are not disposed, a first extending portiondisposed to extend from the body cover portion between the firstelectrode layer and the first conductive resin layer of the first bandportion, and a second extending portion disposed to extend from the bodycover portion between the second electrode layer and the secondconductive resin layer of the second band portion.

According to another aspect of the present disclosure, a multilayerelectronic component includes a body having first internal electrodesand second internal electrodes that are alternately stacked to overlapwith each other and have dielectric layers interposed therebetween, andfirst and second external electrodes respectively connected to the firstand second internal electrodes, each including an electrode layerconnected to the first internal electrodes or the second internalelectrodes, and each including a conductive resin layer disposed on theelectrode layer. The first and second external electrodes are disposedon respective opposing external surfaces of the body, and each extendfrom the respective opposing external surface to an adjacent externalsurface of the body and a corner therebetween, and a non-conductiveresin layer is disposed in a region of the external surfaces of the bodyin which the electrode layers of the first and second externalelectrodes are not disposed, and the non-conductive resin layer isdisposed between the electrode layer and the conductive resin layer ofeach of the first and second external electrodes in each of the opposingexternal surfaces and adjacent external surfaces in which the first andsecond external electrodes are disposed.

BRIEF DESCRIPTION OF DRAWINGS

The above and other aspects, features, and advantages of the presentdisclosure will be more clearly understood from the following detaileddescription, taken in conjunction with the accompanying drawings, inwhich:

FIG. 1 is a schematic perspective view of a multilayer electroniccomponent according to an embodiment of the present disclosure;

FIG. 2 is a cross-sectional view taken along line I-I′ in FIG. 1 ;

FIG. 3 is a schematic exploded perspective view of a body, in whichdielectric layers and internal electrodes are laminated, according to anembodiment of the present disclosure;

FIG. 4 is an enlarged view of region P in FIG. 2 ;

FIG. 5 is a schematic perspective view of a multilayer electroniccomponent according to another embodiment of the present disclosure;

FIG. 6 is a cross-sectional view taken along line II-II′ in FIG. 5 ;

FIG. 7 illustrates measurements result of arc discharge tests on samplechips (Comparative Example) in which a non-conductive resin layer is notdisposed;

FIG. 8 illustrates measurement results of arc discharge tests on samplechips (Inventive Example) in which a non-conductive resin layer isdisposed, according to an embodiment of the present disclosure; and

FIG. 9 is a cross-sectional view taken along line I-I′ in FIG. 1 , incase of adding plating layers.

DETAILED DESCRIPTION

Hereinafter, embodiments of the present disclosure will be describedwith reference to specific embodiments and the accompanying drawings.However, embodiments of the present disclosure may be modified to havevarious other forms, and the scope of the present disclosure is notlimited to the embodiments described below. Further, embodiments of thepresent disclosure may be provided for a more complete description ofthe present disclosure to the ordinarily skilled artisan. Therefore,shapes and sizes of the elements in the drawings may be exaggerated forclarity of description, and the elements denoted by the same referencenumerals in the drawings may be the same elements.

In the drawings, portions not related to the description will be omittedfor clarification of the present disclosure, and a thickness may beenlarged to clearly show layers and regions. The same reference numeralswill be used to designate the same components. Further, throughout thespecification, when an element is referred to as “comprising” or“including” another element, it means that the element may furtherinclude other elements as well, without departing from the otherelements, unless specifically stated otherwise.

In the drawing, an X direction may be defined as a second direction, anL direction, or a longitudinal direction; a Y direction may be definedas a third direction, a W direction, or a width direction; and a Zdirection may be defined as a first direction, a stacking direction, a Tdirection, or a thickness direction.

Multilayer Electronic Component

FIG. 1 is a schematic perspective view of a multilayer electroniccomponent according to an embodiment.

FIG. 2 is a cross-sectional view taken along line I-I′ in FIG. 1 .

FIG. 3 is a schematic exploded perspective view of a body, in whichdielectric layers and internal electrodes are laminated, according to anembodiment.

FIG. 4 is an enlarged view of region P in FIG. 2 .

Hereinafter, a multilayer electronic component 100 according to anembodiment will be described with reference to FIGS. 1 to 4 .

A multilayer electronic component 100 according to an embodiment mayinclude a body 110 including dielectric layers 111, and first and secondinternal electrodes 121 and 122 alternately laminated with respectivedielectric layers 111 interposed therebetween, and having first andsecond surfaces 1 and 2 opposing each other in a lamination direction (aZ direction), third and fourth surfaces 3 and 4 connected to the firstand second surfaces 1 and 2 and opposing each other, and fifth and sixthsurfaces 5 and 6 connected to the first to fourth surfaces 1, 2, 3, and4 and opposing each other, a first external electrode 131 including afirst electrode layer 131 a connected to the first internal electrode(s)121 and a first conductive resin layer 131 b disposed on the firstelectrode layer 131 a, and having a first connection portion A1 disposedon the third surface 3 of the body 110 and a first band portion B1extending from the first connection portion A1 to a portion of each ofthe first, second, fifth, and sixth surfaces 1, 2, 5, and 6, a secondexternal electrode 132 including a second electrode layer 132 aconnected to the second internal electrode(s) 122 and a secondconductive resin layer 132 b disposed on the second electrode layer 132a, and having a second connection portion A2 disposed on the fourthsurface 4 of the body 110 and a second band portion B2 extending fromthe second connection portion A2 to a portion of each of the first,second, fifth, and sixth surfaces 1, 2, 5, and 6, and a non-conductiveresin layer 140 having a body cover portion 143 disposed in a region ofexternal surfaces of the body 110 in which the first and secondelectrode layers 131 a and 132 a are not disposed, a first extendingportion 141 disposed to extend from the body cover portion 143 betweenthe first electrode layer 131 a and the first conductive resin layer 131b of the first band portion B1, and a second extending portion 142disposed to extend from the body cover portion 143 between the secondelectrode layer 132 a and the second conductive resin layer 132 b of thesecond band portion B2.

In the body 110, the dielectric layers 111 and the internal electrodes121 and 122 are alternately laminated.

The body 110 is not limited in shape, but may have a hexahedral shape ora shape similar thereto. Due to shrinkage of ceramic powder particlesincluded in the body 110 during sintering, the body 110 may have asubstantially hexahedral shape rather than a hexahedral shape havingcomplete straight lines or edges.

The body 110 may have the first and second surfaces 1 and 2 opposingeach other in a thickness direction (a Z direction), the third andfourth surfaces 3 and 4 connected to the first and second surfaces 1 and2 and opposing each other in a length direction (an X direction), andthe fifth and sixth surfaces 5 and 6 connected to the first and secondsurfaces 1 and 2 and as well as to the third and fourth surfaces 3 and 4and opposing each other in a width direction (a Y direction).

The plurality of dielectric layers 111, constituting the body 110, is ina sintered state and the dielectric layers 111 may be integrated witheach other such that boundaries therebetween may not be readily apparentwithout using a scanning electron microscope (SEM).

According to an embodiment, a raw material forming the dielectriclayer(s) 111 is not limited as long as sufficient capacitance may beobtained. For example, a barium titanate-based material, a leadcomposite perovskite-based material, a strontium titanate-basedmaterial, or the like, may be used.

Various ceramic additives, organic solvents, plasticizers, binders,dispersants, or the like may be added to the powder of barium titanate(BaTiO₃), and the like, according to the purpose of the presentdisclosure, as the material for forming the dielectric layer 111.

The body 110 may have a capacitance forming portion disposed in the body110 and including the first and second internal electrode layers 121 and122, alternately disposed to overlap each other with the dielectriclayer(s) 111 interposed therebetween, to form capacitance, and upper andlower protective layers 112 and 113 disposed above and below thecapacitance forming portion.

The capacitance forming portion may contribute to capacitance formationof a capacitor, and may be formed by repeatedly laminating the pluralityof first and second internal electrode layers 121 and 122 with thedielectric layers 111 interposed therebetween.

The upper protective layer 112 and the lower protective layer 113 may beformed by laminating a single dielectric layer or two or more dielectriclayers on upper and lower surfaces of the capacitance forming portion,respectively, in the vertical direction, and may basically play a rolein preventing damage to the internal electrodes due to physical orchemical stress.

The upper protective layer 112 and the lower protective layer 113 maynot include any internal electrode(s), and may include the same materialas the dielectric layer 111.

The plurality of internal electrodes 121 and 122 may be disposed tooverlap each other with the dielectric layer(s) 111 interposedtherebetween.

The internal electrodes 121 and 122 may include first and secondinternal electrodes 121 and 122 alternately disposed to overlap eachother with respective dielectric layers interposed therebetween.

The first and second internal electrodes 121 and 122 may be exposed tothe third and fourth surfaces 3 and 4, respectively.

Referring to FIG. 2 , the first internal electrode(s) 121 may be spacedapart from the fourth surface 4 and may be exposed through the thirdsurface 3, and the second internal electrode(s) 122 may be spaced apartfrom the third surface 3 and may be exposed through the fourth surface4. The first external electrode 131 may be disposed on the third surface3 of the body 110 to be connected to the first internal electrode(s)121, and the second external electrode 132 may be disposed on the fourthsurface 4 of the body 110 to be connected to the second internalelectrode(s) 122.

For example, the first internal electrode(s) 121 is/are not connected tothe second external electrode 132 and is/are connected to the firstexternal electrode 131, and the second internal electrodes 122 is/arenot connected to the first external electrode 131 and is/are connectedto the second external electrode 132. Thus, the first internal electrode(s) 121 is/are formed to be spaced apart from the fourth surface 4 by apredetermined distance, and the second internal electrode(s) 122 is/areformed to be spaced apart from the third surface 3 by a predetermineddistance.

The first and second internal electrodes 121 and 122 may be electricallyisolated from each other by the dielectric layer(s) 111 disposedtherebetween.

Referring to FIG. 3 , the body 110 may be formed by alternatelylaminating dielectric layer(s) 111 on which the first internal electrode121 is printed and dielectric layer(s) 111 on which the second internalelectrode 122 is printed, in a thickness direction (a Z direction) andsintering the alternately laminated dielectric layers 111.

The material forming the first and second internal electrodes 121 and122 is not limited. For example, the first and second internalelectrodes 121 and 122 may be formed using a conductive paste containinga noble metal material such as palladium (Pd), a palladium-silver(Pd—Ag) alloy, or the like, nickel (Ni), and copper (Cu).

A method of printing the conductive paste may be a screen-printingmethod, a gravure printing method, or the like, but is not limitedthereto.

The external electrodes 131 and 132 are disposed on the body 110 andinclude electrode layers 131 a and 132 a and conductive resin layers 131b and 132 b, respectively.

The external electrodes 131 and 132 may include first and secondexternal electrodes 131 and 132, respectively connected to the first andsecond internal electrodes 121 and 122.

The first external electrode 131 includes a first electrode layer 131 aand a first conductive resin layer 131 b, and the second externalelectrode 132 includes a second electrode layer 132 a and a secondconductive resin layer 132 b.

When the first external electrode 131 is divided with reference to FIG.2 depending on a position in which it is disposed, the first externalelectrode 131 has a first connection portion A1, disposed on the thirdsurface 3 of the body, and a band portion B1 extending from the firstconnection portion A1 to a portion of the first, second, fifth, andsixth surfaces 1, 2, 5, and 6.

A region between the first connection portion A1 and the first bandportion B1 may be defined as a first corner portion C1.

When the second external electrode 132 is divided depending on aposition in which it is disposed, the second external electrode 132 hasa second connection portion A2, disposed on the fourth surface 4 of thebody, and a band portion B2 extending from the second connection portionA2 to a portion of the first, second, fifth, and sixth surfaces 1, 2, 5,and 6.

A region between the second connection portion A2 and the second bandportion B2 may be defined as a second corner portion C2.

The first and second electrode layers 131 a and 132 a may be formedusing any material as long as it is a material having electricalconductivity such as a metal or the like, and a specific material may bedetermined in consideration of electrical characteristics, structuralstability, and the like.

For example, the first and second electrode layers 131 a and 132 a mayinclude a conductive metal and glass.

A conductive metal, used for the electrode layers 131 a and 132 a, isnot limited as long as it may be electrically connected to therespective internal electrode (s) to form capacitance and may include atleast one selected from the group consisting of, for example, copper(Cu), silver (Ag), nickel (Ni), and alloys thereof.

The electrode layers 131 a and 132 a may be formed by applying aconductive paste, prepared by adding a glass frit, to the conductivemetal powder particles and sintering the conductive paste.

When the first and second electrode layers 131 a and 132 a include aconductive metal and glass, corner portions, at which the connectionportions A1 and A2 and the band portions B1 and B2 meet, may be formedto be thin, or lifting may occur between ends of the band portions B1and B2 and the body 110. Therefore, since moisture resistancereliability may be problematic, an effect of improving the moisturereliability may be more effective when the first and second electrodelayers 131 a and 132 a include a conductive metal and glass.

The first and second electrode layers 131 a and 132 a may be formed bymeans of atomic layer deposition (ALD), molecular layer deposition(MLD), chemical vapor deposition (CVD) sputtering, or the like.

In addition, the first and second electrode layers 131 a and 132 a maybe formed by transferring a sheet, including a conductive metal, ontothe body 110.

The conductive resin layers 131 b and 132 b may include a conductivemetal and a base resin.

The conductive metal, included in the conductive resin layers 131 b and132 b, serves to electrically connect the conductive resin layers 131 band 132 b to first plating layers formed thereon.

The conductive metal, included in the conductive resin layers 131 b and132 b, is not limited as long as it may be electrically connected to thefirst plating layers and may include at least one selected from thegroup consisting of, for example, copper (Cu), silver (Ag), nickel (Ni),and alloys thereof.

The conductive metal, included in the conductive resin layers 131 b and132 b, may include at least one of spherical powder particles and flakepowder particles. For example, the conductive metal may include onlyflake powder particles, or only spherical powder particles, or a mixtureof flake powder particles and spherical powder particles.

The spherical powder particles may have an incompletely spherical shapeand may have, for example, a shape in which a ratio of a length of amajor axis to a length of a minor axis (the major axis/the minor axis)that is 1.45 or less.

The flake powder particles refer to powder particles, each having a flatand elongated shape, and is not limited to a specific shape and, forexample, a ratio of a length of a major axis and a length of a minoraxis (the major axis/the minor axis) may be 1.95 or more.

The lengths of the major axes and the minor axes of the spherical powderparticles and the flake powder particles may be measured from an imageobtained by scanning a cross section (an L-T cross section), taken froma central portion of a multilayer electronic component in a width (Y)direction, in X and Z directions with a scanning electron microscope(SEM).

The base resin, included in the conductive resin layers 131 b and 132 b,serves to secure adhesion and to absorb impact.

The base resin, included in the conductive resin layers 131 b and 132 b,is not limited as long as it has adhesion and impact absorption and ismixed with conductive metal powder particles to prepare a paste and mayinclude, for example, an epoxy-based resin.

In addition, the conductive resin layer may include a plurality of metalparticles, an intermetallic compound, and a base resin.

According to the present disclosure, a non-conductive resin layer (e.g.,140) may be disposed to extend between an electrode layer (e.g., 131 aand 132 a) and a conductive resin layer (e.g., 131 b and 132 b,respectively), or a plurality of island-shaped adhesive portions may bedisposed on a first electrode layer of a first connection portion and asecond electrode layer of a second connection portion. Therefore, acontact area between the electrode layer and the conductive resin layermay be reduced. As a result, electrical connectivity between theelectrode layer and the conductive resin layer may be deteriorated.

However, according to an embodiment, when the conductive resin layerincludes a plurality of metal particles, an intermetallic compound, anda base resin, stable electrical connectivity may be secured.

The intermetallic compound may serve to connect a plurality of metalparticles to improve electrical connectivity, and may serve to surroundand connect the plurality of metal particles to each other.

In this case, the intermetallic compound may include a metal having amelting point lower than curing temperature of the base resin.

For example, since the intermetallic compound includes a metal having amelting point lower than the curing temperature of the base resin, themetal having a melting point lower than the curing temperature of thebase resin is melted during drying and curing processes, and form anintermetallic compound with a portion of the metal particles to surroundthe metal particles. In this case, the intermetallic compound mayinclude, in detail, a metal having a low melting point of 300° C. orless.

For example, the intermetallic compound may include tin (Sn) having amelting point of 213 to 220° C. During the drying and curing processes,Sn is molten. The molten Sn wets metal particles having a high meltingpoint such as Ag, Ni, or Cu due to capillarity, and reacts with aportion of Ag, Ni, or Cu metal particles to form an intermetalliccompound such as Ag₃Sn, Ni₃Sn₄, Cu₆Sn₅, Cu₃Sn, or the like. Ag, Ni, orCu, not participating in reaction, remains in the form of metalparticles.

Accordingly, the plurality of metal particles may include one or more ofAg, Ni, and Cu, and the intermetallic compound may include one or moreof Ag₃Sn, Ni₃Sn₄, Cu₆Sn₅, and Cu₃Sn.

Referring to FIG. 9 , plating layers 131 c and 132 c may be additionallyprovided on the conductive resin layers 131 b and 132 b, respectively,to improve mounting characteristics of the external electrodes 131 and132.

For example, the plating layers 131 c and 132 c may be Ni plating layersor Sn plating layers, or may include Ni plating layers and Sn platinglayers, respectively and sequentially formed on the conductive resinlayers. Alternatively, the plating layers 131 c and 132 c may include aplurality of Ni plating layers and/or a plurality of Sn plating layers.

The non-conductive resin layer 140 has a body cover portion 143 disposedin a region of the external surfaces of the body 110 in which the firstand second electrode layers 131 a and 132 a are not disposed, a firstextending portion 141 disposed to extend from the body cover portion 143between the first electrode layer 131 a and the first conductive resinlayer 131 b of the first band portion B1, and a second extending portion142 disposed to extend from the body cover portion 143 between thesecond electrode layer 132 a and the second conductive resin layer 132 bof the second band portion B2.

The non-conductive resin layer 140 serves to prevent stress, generatedwhen a substrate is deformed by thermal and physical impacts while themultilayer electronic component 100 is mounted on the substrate, frompropagating to the body 110 and to prevent cracking.

In addition, the non-conductive resin layer 140 serves to improvemoisture resistance by blocking moisture permeation paths.

The base resin, included in the conductive resin layers 131 b and 132 b,also plays a role in absorbing impacts, but the role of the base resinis limited.

In addition, when lengths of the first and second conductive resinlayers 131 b and 132 b are increased to enhance bending stress,short-circuit may occur between the first and second conductive resinlayers 131 b and 132 b and arc discharge may occur between the band endsof the first and second resin layers 131 b and 132 b under a highvoltage.

Meanwhile, since the body cover portion 143 has an insulating property,it is disposed in a region of the external surfaces of the body 110 inwhich the first and second electrode layers 131 a and 132 a are notdisposed, and thus the body cover portion 143 is disposed in a widerregion to be more effective in absorbing impact and suppressing stresspropagation.

The body cover portion 143 may prevent moisture from permeating into thebody 110 through the external surface of the body 100 by sealing finepores or cracking of the body 110.

In addition, the body cover portion 143 may suppress exposure of thesurface of the body 110 to prevent arc discharge from occurring.

The first extending portion 141 is disposed to extend from the bodycover portion 143 between the first electrode layer 131 a and the firstconductive resin layer 131 b of the first band part B1, serving tosuppress stress propagation to the body 110 and to prevent cracking.

In addition, the first extending portion 141 serves to suppress liftingbetween an end of the first electrode layer 131 a, disposed on the firstband portion B1, and the body 110 to improve moisture resistancereliability.

The second extending portion 142 is disposed to extend from the bodycover portion 143 between the second electrode layer 132 a and thesecond conductive resin layer 132 b of the second band portion B2,serving to suppress stress propagation to the body 110 and to preventcracking.

In addition, the second extending portion 142 serves to improve moistureresistance reliability by suppressing lifting between an end of thesecond electrode layer 132 a, disposed in the second band portion B2,and the body 110.

The non-conductive resin layer 140 may be formed by forming the firstand second electrode layers 131 a and 132 a on the body 110 includingdielectric layers and internal electrodes, forming a non-conductiveresin layer 140 on an exposed external surface of the body 110 and onthe first and second electrode layers 131 a and 132 a, and removing thenon-conductive resin layer 140 formed on the connection portions A1 andA2 of the first and second electrode layers 131 a and 132 a.

A method of removing the non-conductive resin 140 may be, for example,laser processing, mechanical polishing, dry etching, wet etching,shadowing deposition using a tape protective layer, or the like.

The non-conductive resin layer 140 may include a base resin.

The base resin, included in the non-conductive resin layer 140, is notlimited as long as adhesion and impact absorption are provided thereby,and may be, for example, an epoxy-based resin.

The non-conductive resin layer 140 may include a base resin, and mayinclude one or more of silica, alumina, glass, or zirconium dioxide(ZrO₂).

Silica, alumina, glass, and zirconium dioxide (ZrO₂) serve to improve anapplying shape of the non-conductive resin layer 140. In addition,silica, alumina, glass, and zirconium dioxide (ZrO₂) may also serve toimprove thermal resistance.

FIG. 7 illustrates measurement results obtained by preparing a total often sample chips (Comparative Examples, #1 to #10), in which thenon-conductive resin layer 140 is not disposed, and repeatedly measuringarc discharge occurrence voltages for the respective sample chips(Comparative Examples, #1 to #10) five times.

FIG. 8 illustrates measurement results obtained by preparing a total often sample chips (Inventive Examples, #11 to #20), in which thenon-conductive resin layer 140 according to an embodiment is disposed,and repeatedly measuring arc discharge occurrence voltages for therespective sample chips (Inventive Examples, #11 to #20) five times.

Referring to FIG. 7 , there were four cases in which arc dischargeoccurred at a voltage of 2 kV or less, and an average value of the arcdischarge occurrence voltages was about 2.5 kV.

Meanwhile, referring to FIG. 8 , in the case of Inventive Examples,there was no case in which arc discharge occurred up to a voltage of 2.5kV, in a total of 50 experiments, and an average value of the arcdischarge occurrence voltages was 3.0 kV or more. As a result, InventiveExamples were excellent in providing an arc discharge suppressioneffect.

The first extending portion 141 may be disposed to cover the firstcorner portion C1 of the first electrode layer 131 a, and the secondextending portion 142 may be disposed to cover the second corner portionC2 of the second electrode layer 132 a.

When the electrode layers 131 a and 132 a include a conductive metal andglass, the electrode layers 131 a and 132 a of the corner portions C1and C2 (e.g., in regions between the connection portions A1 and A2 andthe band portions B1 and B2) may be formed to be thin. Therefore, thecorner portions C1 and C2 may act as main moisture permeation paths todeteriorate moisture resistance reliability.

In this regard, the extending portions 141 and 142 may be disposed tocover the corner portions C1 and C2 of the electrode layers 131 a and132 a, and thus, may block the moisture permeation paths to improve themoisture resistance reliability.

Moreover, the first extending portion 141 may be disposed to extends toa portion between the first electrode layer 131 a and the firstconductive resin layer 131 b of the first connection portion A1, and thesecond extending portion 142 may be disposed to extend to a portionbetween the second electrode layer 132 a and the second conductive resinlayer 132 b of the second connection portion A2, and thus, may reliablyblock the moisture permeation paths to further improve the moistureresistance reliability.

Lengths of the first band portion B1 of the first conductive resin layer131 b and of the second band portion B2 of the second conductive resinlayer 132 b may each be 10 to 20% of a length of the body 110.

Referring to FIGS. 2 and 4 , a length of the body may refer to adistance between a third surface and a fourth surface of the body, alength of the first band portion B1 of the first conductive resin layer131 b may be a distance B1 b from the third surface of the body to anend of the first conductive resin layer 131 b, and a length of thesecond band portion B2 of the second conductive resin layer 132 b may bea distance from the fourth surface of the body to an end of theconductive resin layer 131 b.

When the non-conductive resin layer 140 is not disposed, lengths of thefirst band portion B1 of the first conductive resin layer 131 b and ofthe second band portion B2 of the second conductive resin layer 132 bmay each be maintained to be 20 to 30% of the length of the body 110 tosecure the bending strength.

Meanwhile, when the non-conductive resin layer 140 is disposed accordingto an embodiment, sufficient bending strength may be secured even if thefirst band portion B1 of the first conductive resin layer 131 b and thesecond band portion B2 of the second conductive resin layer 132 b areeach 10 to 20% of the length of the body 110. Therefore, the arcdischarge suppressing effect may be further improved.

In addition, to further improve the bending strength, the distance B1 bfrom the third surface of the body 110 to the end of the firstconductive resin layer 131 b may be greater than a distance B1 a fromthe third surface of the body 110 to an end of the first electrode layer131 a. Similarly, a distance from the fourth side of the body 110 to anend of the second conductive resin layer 132 b may be greater than adistance from the fourth side of the body 110 to an end of the secondelectrode layer 132 a.

FIG. 5 is a schematic perspective view of a multilayer electroniccomponent according to another embodiment.

FIG. 6 is a cross-sectional view taken along line II-II′ in FIG. 5 .

Hereinafter, a multilayer electronic component 100′ according to theother embodiment will be described with reference to FIGS. 5 and 6 .However, descriptions common to the laminated electronic component 100according to an embodiment will be omitted to avoid duplicatedescriptions.

The multilayer electronic component 100′ according to another embodimenthas a plurality of island-shaped adhesive portions 151 and 152 disposedon a first connecting portion A1 of a first electrode layer 131 a and ona second connecting portion A2 of a second electrode layer 132 a.

Referring to FIG. 6 , the plurality of island-shaped adhesive portions151 and 152 may be disposed between the first electrode layer 131 a andthe first conductive resin layer 131 b of the first connection portionA1 and between the second electrode layer 132 a and the secondconductive resin layer 132 b of the second connection portion A2.

The plurality of island-shaped adhesive portions 151 and 152 serves toimprove adhesion between the electrode layer and the conductive resinlayer. As the adhesion between the electrode layer and the conductiveresin layer is improved, a defect such as electrode lifting, or thelike, may be prevented.

Each of the plurality of island-shaped adhesive portions 151 and 152 mayinclude a base resin, and may correspond to an isolated segment ofadhesive portion spaced apart from other isolated segments of adhesiveportion on the connection portions A1 and A2.

The base resin, included in each of the plurality of island-shapedadhesive portions 151 and 152, is not limited as long as adhesion andimpact absorption are provided thereby, and may be, for example, anepoxy-based resin.

Each of the plurality of island-shaped adhesive portions 151 and 152 mayinclude a base resin, and may include one or more of silica, alumina,glass, or zirconium dioxide (ZrO₂). Silica, alumina, glass, andzirconium dioxide (ZrO₂) may serve to improve an applying shape of eachof the plurality of island-shaped adhesive portions 151 and 152 and toimprove thermal resistance.

The plurality of island-shaped adhesive portions 151 and 152 may beformed by forming the first and second electrode layers 131 a and 132 aon the body 110 including dielectric layers and internal electrodes,forming a non-conductive resin layer 140 on an exposed external surfaceof the body 110 and the first and second electrode layers 131 a and 132a, and removing only a portion of the non-conductive resin layer 140formed on the connection portions A1 and A2 of the first and secondelectrode layers 131 a and 132 a.

Therefore, the plurality of island-shaped adhesive portions 151 and 152may be formed of the same material as the non-conductive resin layer140.

An area of the plurality of island-shaped adhesive portions 151 may be20 to 40% of an area of the first connection portion A1 of the firstelectrode layer 131 a, or an area of the plurality of island-shapedadhesive portions 152 may be 20 to 40% of an area of the secondconnection portion A2 of the second electrode layer 132 a.

Table 1 shows ESR and adhesion evaluation results depending on a ratioof an area S2 of adhesive portions to an area S1 of a connection portionof an electrode layer (S2/S1).

The adhesion was evaluated by measuring energy needed to remove aconductive resin layer from the electrode layer using a bond tester. Ascompared with a case in which the area S2 of the adhesive portion is 0,a case in which an adhesive force improvement effect was less than 5%was indicated by Δ, a case in which the effect was 5% or more to 20% orless was indicated by ∘, and a case in which the effect was 20% or morewas indicated by ⊚.

ESR evaluation was performed by measuring ESR of 100 samples at amagnetic resonance frequency using an LCR meter. A case in which acoefficient of variation (CV) was more than or equal to 10% wasindicated by Δ, a case in which the CV was 3% or more to less than 10%was indicated by ∘, and a case in which the CV was less than 3% wasindicated by ⊚.

TABLE 1 No. S2/S1 ESR Adhesion 1 0.1 ⊚ Δ 2 0.2 ◯ ◯ 3 0.3 ◯ ◯ 4 0.4 ◯ ◯ 50.5 Δ ⊚

In the case of Test No. 1 in which the ratio of an area S2 of anadhesive portion to an area S1 of a connection portion of an electrodelayer (S2/S1) is 0.1, ESR characteristics are excellent but the adhesionis poor.

In the case of Test No. 5 in which the ratio of an area S2 of anadhesive portion to an area S1 of a connection portion of an electrodelayer (S2/S1) is 0.5, the adhesion is excellent but ESR characteristicsare poor.

Therefore, the area of each of the plurality of island-shaped adhesiveportions 151 and 152 may be set to 20 to 40% of the area of the firstconnection portion A1 of the first electrode layer 131 a or the area ofthe second connection portion A2 of the second electrode layer 132 a,securing both excellent adhesion and excellent ESR characteristics.

As described above, a multilayer electronic component may include anon-conductive resin layer including a body cover portion disposed in aregion of an external surface of a body in which an electrode layer isnot disposed, and an extending portion extending from the body coverportion between an electrode layer and a conductive resin layer ofexternal electrodes, and thus, may suppress arc discharge.

In addition, the non-conductive resin layer may be provided to improvebending strength characteristics.

While embodiments have been shown and described above, it will beapparent to those skilled in the art that modifications and variationscould be made without departing from the scope of the present disclosureas defined by the appended claims.

What is claimed is:
 1. A multilayer electronic component comprising: abody including dielectric layers, and first internal electrodes andsecond internal electrodes alternately laminated with respectivedielectric layers interposed therebetween, and having first and secondsurfaces opposing each other in a lamination direction, third and fourthsurfaces connected to the first and second surfaces and opposing eachother in a length direction of the body, and fifth and sixth surfacesconnected to the first to fourth surfaces and opposing each other; afirst external electrode including a first electrode layer connected tothe first internal electrodes and a first conductive resin layerdisposed on the first electrode layer, and having a first connectionportion disposed on the third surface of the body and a first bandportion extending from the first connection portion to a portion of eachof the first, second, fifth, and sixth surfaces; a second externalelectrode including a second electrode layer connected to the secondinternal electrodes and a second conductive resin layer disposed on thesecond electrode layer, and having a second connection portion disposedon the fourth surface of the body and a second band portion extendingfrom the second connection portion to a portion of each of the first,second, fifth, and sixth surfaces; and a non-conductive resin layerhaving a body cover portion disposed in a region of external surfaces ofthe body in which the first and second electrode layers are notdisposed, a first extending portion disposed to extend from the bodycover portion between the first electrode layer and the first conductiveresin layer of the first band portion, and a second extending portiondisposed to extend from the body cover portion between the secondelectrode layer and the second conductive resin layer of the second bandportion, wherein the non-conductive resin layer does not cover the firstand second internal electrodes in the length direction, and thenon-conductive resin layer is disposed to cover at least a portion ofthe first connection portion on the third surface and a portion of thesecond connection portion on the fourth surface.
 2. The multilayerelectronic component of claim 1, wherein the first and second conductiveresin layers include a conductive metal and a base resin.
 3. Themultilayer electronic component of claim 1, wherein the non-conductiveresin layer includes a base resin, and includes one or more of silica,alumina, glass, or zirconium dioxide (ZrO₂).
 4. The multilayerelectronic component of claim 1, wherein when a portion of the firstexternal electrode between the first connection portion and the firstband portion is defined as a first corner portion, and a portion of thesecond external electrode between the second connection portion and thesecond band portion is defined as a second corner portion, the firstextending portion is disposed to cover the first electrode layer of thefirst corner portion, and the second extending portion is disposed tocover the second electrode layer of the second corner portion.
 5. Themultilayer electronic component of claim 1, wherein a distance of thefirst conductive resin layer from the third surface of the body to anend of the first conductive resin layer is greater than a distance ofthe first electrode layer from the third surface of the body to an endof the first electrode layer.